The STMicroelectronics LIS2DTW12 combines a MEMS 3-axis accelerometer and a temperature sensor on a single die for use in space-constrained and battery-sensitive detectors such as shipping trackers, wearables, and IoT endpoints. The sensing accuracy of 0.
2019-05-21“The joint development in the area of Single Pair Ethernet continues and consolidates the successful technology partnership of both companies,” says Hirose President Kazunori Ishii. The duo’s partnership was announced in the autumn of 2016 when Hirose and
2019-05-21The advanced antenna systems in modern devices leverage beam steering and multiple data stream transmission to meet 5G throughput requirements. XFdtd provides performance metrics for 5G beam steering applications by simulating the radiation pattern for d
2019-05-09A new high-performance socket handles 0.4-mm-pitch BGA 25-pin devices. The CG-BGA-5030 socket is designed for the 2.125×2.225-mm package size and operates at a bandwidth up to 30 GHz with less than 1 dB of insertion loss. The socket is designed with an ea
2019-05-09Infineon Technologies AG is launching its first magnetic sensors based on TMR technology. This makes the company the world’s first sensor manufacturer to offer magnetic sensors based on all four magnetic technologies: HALL, GMR, AMR and TMR. Infineon will
2019-05-05D3 Engineering has introduced a new line of rugged camera modules for automotive and industrial vision. The new DesignCore D3RCM Rugged Camera Modules integrate OmniVision or SONY image sensors with Texas Instruments’ FPD-Link III SerDes for full digital
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